Clarity 3D Solver Training
日期 | 版本 | 国家/地区 | 位置 | |
---|---|---|---|---|
Scheduled upon demandOn demand | EXPRESS INTERESTINQUIRE |
版本 | 区域 | |
---|---|---|
2024.0 | Online | ENROLL |
2023.1 | Online | ENROLL |
Other Versions | Online | EXPRESS INTERESTINQUIRE |
Length: 2 Days (16 hours)
Become Cadence Certified
Course Description
Cadence® Clarity™ 3D Solver is a 3D electromagnetic (EM) simulation software tool for designing critical interconnects for PCBs, IC packages, and system on IC (SoIC) designs. This course will introduce the Clarity 3D Layout and 3D Workbench applications. You will use Clarity 3D Layout to import a PCB model and use the 3D field solver to generate a model for the passive elements that make up the transmission lines for the signals. You will then use the Clarity 3D Workbench to import a 3D STEP model of a connector, use commands to create new 3D components, and then merge the connector with a PCB to run the 3D field solver and run a simulation.
Learning Objectives
After completing this course, you will be able to:
- Import PCB and interposer models into Clarity 3D Layout
- Specify a cut-out region for a PCB
- Generate ports for simulation
- Set up the simulator by controlling frequency settings, solver settings and geometry options
- Run 3D electromagnetic simulations
- View and plot the waveform, mesh and field results
- Import 3D STEP models into Clarity 3D Workbench
- Create components in Clarity 3D Workbench
- Merge 3D models with a PCB
- Run 3D electromagnetic simulations of the merged 3D model and PCB
- Automate portions of the design process with Tcl
Software Used in This Course
- Clarity 3D Solver
Software Release(s)
SIGRITY2024.0
Modules in this Course
- Clarity 3D Layout Introduction
- Clarity 3D Layout Simulation Setup
- Clarity 3D Layout Simulation
- Clarity 3D Workbench
- Connector and PCB Simulation
- Clarity 3D Workbench Creating Terminal Wave Ports
- Clarity 3D Workbench Example -- Inset Fed Patch Antenna
- Clarity 3D Workbench Example -- Broadband Printed Quasi-Yagi Antenna
- Inteproser Modeling with GDS to SPD
- Model Extraction Flow for Rigid-Flex Design
- Tcl Script Automation
Audience
- Signal Integrity Engineers
- PCB and IC Package Designers
Prerequisites
You should have experience with or knowledge of the following:
- Basic PCB and IC packaging concepts
- Basic knowledge of 3D electromagnetic simulation
Related Courses
Please see course learning maps at this link for a visual representation of courses and course relationships. Regional course catalogs may be viewed here.
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