Overview
Supercharged, Easy-to-Use System Innovation
The Cadence Systems Design and Analysis Platform products ensure performance, security, and streamlined design from chip to package to board to case. Integrated with in-design multiphysics system analysis tools, the platform lets you tackle the most complicated EMI/EMC, power, signal, and thermal integrity challenges with ease, guaranteeing your product is right the first time, every time.
With the Cadence System Design and Analysis Platform, you can enhance output quality, reduce rework costs, and exceed customer expectations. Experience the future of electronics design with us.
Platforms Collections
Cadence Software: Where Design Meets Intelligence
Key Benefits
High-Accuracy Results for Accelerated Time to Market
In-Design, High-Performance Platform
Reduce design effort and time with earlier simulation and analysis built into your system design platform. This allows you to create high-performance, secure electronics systems efficiently, from chip to case, all within a smaller package.
Unmatched Efficiency and Scalability
Experience massive performance gains (up to 10X faster) with the System Design and Analysis Platform, allowing you to tackle complex designs with virtually unlimited capacity.
Differentiation Through Innovation
Develop cutting-edge system designs that set you and your company apart, enabling you to create high-quality, secure systems with exceptional performance and a competitive advantage.
Shift Left
Solving Your Most Complex System Design Challenges with Cadence.AI
The electronics industry is in a high-stakes race. The demand for ever-better products, delivered at lightning speed, is pushing the boundaries of design. Here's where a revolutionary approach called shift left in-design and analysis steps up to the challenge.
Imagine a platform that combines the power of cutting-edge AI, intelligent system design, and high-performance analysis software – all rolled into one. This is the magic behind the shift left methodology. By incorporating analyses of critical factors like electromagnetics, thermal, and signal integrity early in the design process (traditionally left for later stages), you gain a superpower: the ability to identify and fix problems before they slow you down.
What's New
Platform Solutions
Supercharge Your Systems Design With AI-Powered Speed and Engineering Quality
PCB Design and Analysis
Gone are the days of wrestling with intricate PCB designs! Imagine a world where complex layouts transform from hazy concepts to manufactured reality with remarkable ease. This is the power of AI-driven solutions for PCB design and analysis.
By harnessing the power of in-design analysis, you can streamline your entire workflow, tackling intricate challenges head on. This translates to faster time-to-market, reduced risk of errors, and ultimately, the ability to design PCBs with unparalleled efficiency and excellence.
IC Package Design and Analysis
Supercharge your advanced packaging with groundbreaking design and analysis tools, shattering traditional limitations, ensuring seamless collaboration across domains, and delivering unmatched accuracy. Design chips and packages in perfect harmony for maximized performance and minimized cost.
Effortlessly integrate heterogeneous multi-chip and chiplet designs. Experience unparalleled confidence with a meticulous analysis and verification flow specifically designed for fan-out wafer-level packages (FOWLP). Hit the ground running with reference flows that seamlessly integrate with major foundries and outsourced semiconductor assembly and test (OSAT) providers. This isn't just IC package design and analysis, it's a revolution in advanced packaging, empowering you to create the future of electronics.
Multiphysics System Analysis
Harness the power of multiphysics analysis and conquer your most complex electronic system challenges. Imagine simulating real-world conditions – electromagnetic interference (EMI), thermal, signal, power integrity, and more – all within a seamless design flow.
Our high-performance tools integrate effortlessly with existing platforms, delivering up to 10X faster analysis and unmatched accuracy. Stop battling complexity, start designing groundbreaking electronic systems with confidence.
RF/Microwave Analysis
Tackle challenging RF to millimeter-wave (mmWave) front-end components and wireless subsystems from concept through signoff in silicon radio frequency integrated circuits (RFICs), III-V compound semiconductors, PCBs, and multi-technology modules. The Cadence AWR Design Environment platform electronic design automation (EDA) software suite provides RF/microwave engineers with access to innovative high-frequency circuit, system, and electromagnetic (EM) analysis technologies. Our leading AI-enabled computational software helps you bring multi-fabric systems to market faster.
Computational Fluid Dynamics (CFD)
Accelerate the power of fluid dynamics with Cadence CFD and accelerate innovation. Optimize the performance of products in aerospace, automotive, and beyond – all without relying on costly physical testing.
Streamline workflows and cutting-edge technology by delivering unmatched speed and accuracy, empowering you to conquer complex engineering challenges and bring groundbreaking products to life faster.
Data Center Solutions
Revolutionize your data center with the next-generation design and management platform. Leverage digital twin technology to create a virtual replica of your data center, allowing you to optimize performance and efficiency before anything is built.
Empower engineers to design with cutting-edge simulations, while IT and facilities teams collaborate seamlessly to ensure sustainable operations and meet service-level agreements (SLAs). This is data center management for the future – proactive, collaborative, and built for success.
Support
Need Help?
Cadence Support puts the help you need within easy reach – around the clock, seven days a week. Locate the latest software updates, case and Cadence change request information, technical documentation, articles, and more.
We offer two tiers of support, Basic for those focused on self-service, and Premium for those who want access to Cadence expert-level assistance from our team of support Application Engineers.
| Features | Basic Support | Premium Support |
|---|---|---|
| Access to Cadence Online Support (COS) Portal | ||
| Online Training Content Access | ||
| Forum Access | ||
| Bug Reporting | ||
| Incremental Updates (Bug Fixes) | ||
| AE assistance/Case Filing | ||
| Access to File a Case | ||
| Major Releases |