Overview

Cadence® PHY IP for PCI Express® (PCIe®) 7.0 is a high-performance NRZ/PAM4 SerDes multi-protocol PHY that is PPA optimized for high-performance computing (HPC) and artificial intelligence and machine learning (AI/ML) applications. The ultra-long-reach equalization, robust clock-data recovery capabilities, low data path latency and low power consumption make it ideal for deployment in time-sensitive applications in HPC, AI/ML, data communications, networking, and storage systems. This multi-protocol PHY is highly versatile and scalable and can be configured to support X1, X2, X4, X8, and X16 lane widths with embedded bifurcation capability that allows multiple PCIe links of various link widths to co-exist and operate independently in the same macro.

Key Benefits

High Performance

DSP-based equalization and clock-data-recovery (CDR) offer unmatched channel loss handling performance and reliability

Flexibility

Highly configurable PHY with support for PCIe, CXL, and common electrical standards

Lowest Risk

Brings Cadence’s expertise in PAM4 and PCIe together in the implementation of this emerging standard

Ease of use

Fully verified, pre-integrated IP delivery with package and signal integrity support and firmware for faster bring-up

Features

  • Architecture optimized for HPC, AI/ML, storage, and networking
  • Ultra-long reach, low latency, and low power
  • Advanced DSP delivers unmatched performance and reliability
  • Comprehensive real-time diagnostic, monitor, and test features
  • Bifurcation support for x1, x2, x4, x8, and x16 lanes

Product Apps

  • PPA optimized for 128GT/s PCIe 7.0
  • Supports PCIe protocols and IEEE/OIF 112G standards
  • Robust architecture previously proven in 112G-ULR
  • Supports PAM4 for PCIe 7.0/6.0, NRZ for PCIe 5.0 and below
  • Supports 56-112Gbps PAM4 and 1-56Gbps NRZ Ethernet rates
  • Best-in-class ADC/DSP-based solution with optional MLSD
  • Supports copper pillar bump and micro bump
  • On-die AC coupling for RX
  • Full protocol stack support
  • A comprehensive set of diagnostic and test features enable faster silicon bring-up