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IC packaging design and analysis platform
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Industry’s first unified AI-enabled multiphysics thermal platform that incorporates thermal, stress, and electronics cooling analysis
Formal verification-driven equivalence, low-power, and ECO solutions
Meet PPA and TAT requirements at advanced nodes
Smart formal verification apps developed for C/C++ and RTL level verification to find and fix bugs early in the design cycle
Industry’s first complete library characterization system
Millennium M1 unleashes new CFD predictive capabilities, insight, and performance gains. Learn how you can leverage the power of CFD supercomputing
OpenEye Machine Learning and Molecule Explainer
For individuals, and small businesses or teams
High-performance production-proven layout processing
Improve systematic and parametric yield and meet foundry DFM signoff requirements
Up to 10,000X speedup in design space exploration for 3- to 6+-sigma variation analysis with Monte Carlo simulations
Industry’s Fastest Adopted and Trusted Signoff Solution for FinFET Designs
Generative AI technology for rapid IR design closure
Industry-leading, highest performance simulation platform