Essential High-Speed PCB Design for Signal Integrity Training
日期 | 版本 | 国家/地区 | 位置 | |
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Scheduled upon demandOn demand | EXPRESS INTERESTINQUIRE |
Length: 3 days (24 Hours)
(Course only available in EMEA)
Course Descriptions
This course is part 1 of a training series on “Understanding High Frequency PCB Design - High-Speed, RF, and EMI
Part 1: Essential High-speed PCB Design for Signal Integrity (3 days)
Part 1 applies basic physical principles to develop an understanding of the key issues of high-speed design, from controlling reflections and crosstalk to the design of the power distribution system and the PCB layer structure.
“What if” simulation examples show the effects of varying different parameters, with practical issues considered throughout.
The techniques developed can be applied immediately to improve PCB design, without EDA SI tools, but the course also provides a secure foundation for understanding how to benefit from SI tools.
To complete the Part 1, you could attend the Part 2: PCB Design at RF - multi Gigabit Transmission, EMI Control, and PCB Materials (2 days)
Course Content
Part 1:
- High-speed design overview. What is high-speed? Signal integrity issues for design and layout.
- Signal waveforms, frequency and rise time. Signal bandwidth. How capacitance and loop inductance determine signal quality. Current paths on a PCB.
- Impedance control of the power distribution system. Controlling noise - decoupling networks, PCB planes, bandwidth requirements. Optimizing power delivery.
- Track impedance, reflections and terminations. Practical PCB limits. Input impedance, signal propagation and reflection. Impedance control and termination strategies.
- Differential transmission. Differential and common mode currents, routing and termination.
- Crosstalk. Near end and far end crosstalk, effects of coupled length, track geometry, multiple tracks.
- ICs for high-speed design. I/O characteristics, I/V curves, transition timing. Behavioral device models, IBIS standards.
- PCB routing topologies. Constraints. Discontinuities: connectors, vias, stubs, branching. Equalization, loading, clock distribution.
- PCB structure. Layer stacking principles, fabrication process variables, PCB material effects, impedance measurement.
Audience
- Design engineers seeking in-depth knowledge of high-speed PCB design, signal integrity issues, and EMC. As the course is built up from basic electrical principles it is suitable for engineers with varied experience, and also for new graduates.
- PCB designers working on digital or mixed signal boards with design rules governing track impedance control, line terminations, routing to minimise noise coupling etc.
Prerequisites
- Knowledge of basic electrical principles
Click here to view course learning maps, and here for complete course catalogs.
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"The training course was excellent. Very clear and easy to follow, I enjoyed everything."
Yu-Ting Khoo, Renesas
"Excellent. Great number of useful rules of thumbs, simulations, strong emphasis on understanding rather than remember by heart."
A. Kisiel, Solaris Nat. Synchotron Radiation Centre
“Overall a very good course with many useful information and guidelines.”
Andreas Dressel, Texas Instruments
“Very positive. I liked the parts where real PCBs were shown. The good and bad design practices are better shown that way. (...) everything made for the attendee to feel welcome and maximize the learning curve steepness.”
Maciej Kopec, Solaris Nat. Synchotron Radiation Centre
“The course helped to structure theoretical knowledge I already had, brought some new technical aspects but most of all I liked the practical aspects.”
Claudia Goga, Digilent
“I found the training very enriching(…)very pleased to have participated in it.”
Benoît Resimont, Deltatec