The automotive industry is undergoing significant changes driven by the increased use of semiconductors and software. Today, cars rely heavily on high-performance chips to enable advanced software applications and AI, leading to innovations in vehicle functions. Modern complex electronic control units (ECUs) with higher computing performance, faster data rates, and higher power consumption face significant design, integration, and verification challenges.

Cadence provides integrated design flows and tools for PCB, package, chiplets, and SoC fabrics, ensuring cohesive ECU design and analysis.

cubes image

Simplify complex designs from concept to manufacturing

Accurate

Highly accurate EM, thermal, and RF simulation analysis

Comprehensive

Complete electrothermal co-simulation for the full hierarchy of electronic systems, from ICs to physical enclosures

Cohesive

Ensure the entire system works under wide-ranging operating conditions

  • Tools that help design automotive ECUs and PCBs to be miniaturized, folded, and fitted into automotive housings, targeting specific spaces within the car
  • Advanced and accurate packaging technologies and comprehensive DFM/DFA to create automotive systems with optimized space, weight, and power costs
  • Integrated RF design and analysis with RF-aware models, and EM analysis
  • Electric vehicle Power Module flow including support for various power electronic components, such as silicon carbide MOSFETs
  • Signal, power, and thermal integrity analysis and electromagnetic compliance that are crucial for high-speed communication within automotive ECUs