Success Story
Inphi Reduces Their Time to Market Taping Out 7nm Full Chip Flat with Tempus Timing Signoff
Inphi is the leader in high-speed data movement interconnects. The company moves big data fast, around the globe, between and inside of data centers.
We have used Tempus ECO and Tempus Signoff for all of our advanced-node initiatives. Our design sizes are big and the solution was to run flat STA and Tempus’s DSTA and CMMMC capability. This allows our designers to signoff faster to meet our time-to-market demands. The Tempus solution also allows for faster convergence with Innovus Implementation, due to tight correlation, and provides better PPA. Our designers’ signoff with confidence using Tempus ECO and Signoff.
Weikai Sun, Vp Engineering
Overview