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IC packaging design and analysis platform
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Signal and power integrity analysis platform
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Circuit, system, and EM/thermal simulation for RF to mmWave product development
Intelligent debugging, optimization, and signoff closure
Physics-based simulation software for data center design using digital twin models. The software leverages CFD simulation to facilitate design from conceptual prototyping through to detailed design of the data center
Data center management solution for capacity planning and resource management to maximize operational performance
Physics-based simulation software for the next generation of data center design and management to maximize operational performance
In-design signal and power integrity analysis for IC packages
In-design signal and power integrity analysis for PCBs
The gold standard in chip-level electromagnetic modeling
The fastest synthesis with utmost PCell flexibility
Thermal analysis inside Microwave Office software
A complete electrical-thermal co-simulation technology for IC packages, PCBs, and systems
以模拟精度验证您的最大设计
Enhanced capabilities for multi-chip packaging technologies
Efficiently design complex packages with first-pass success
System-level design planning and optimization from silicon through IC packaging to PCB
Specially designed for floating-point processing with exceptional PPA
Create design intent with ease for simple to complex designs
Improve the accuracy and quality of your component libraries
Fast, intuitive design entry with reuse of preferred, current parts
FPGA-PCB co-design with automatic rules-driven pin assignment
A collaborative environment to improve design team productivity, across the entire lifecycle from requirements to manufacturing.
Managing complexity for faster, more cost-effective implementations
Design collaboration, traceability, and visibility
Maximizing productivity in a powerful library development environment
Integrating RF circuits onto mixed-signal PCB design
System architecture design and implementation for multi-board PCB systems
Frequency-domain power- and signal-integrity analysis
Full 3D finite element method EM analysis software
Product portfolio
3D planar EM analysis software
Communications and radar systems design software
Simulation and design flow technologies for high-frequency PCB development
Simulation and design flow technologies that support MMIC product development
True 3D electromagnetic field solving for PCB and IC package designs
Industry’s first complete library characterization system optimized for the cloud
Meet PPA and TAT targets at advanced nodes
System-driven PPA closure for 3D-IC designs
Unified power calculator for accurate RTL power and signoff-quality gate power
Reduce test time by up to 3X without impact to fault coverage or chip size
In-design and back-end physical verification for faster final signoff
Cloud-ready, massively parallel physical signoff
Easy-to-use, high-performance, and standalone chip-finishing system
Next-generation tool with the fastest performance and scalability, best-in-class accuracy using smart solvers, and in-design and signoff parasitic extraction that customers trust
Fastest path from specification to silicon
Distributed STA with integrated layout fixing
Cost-based power-delivery network design
Full-wave and quasi-static solver technology for IC package and PCB capable of accurate analysis of complex 3D structures
IC package model extraction
Accurately assess high-speed, chip-to-chip system designs
Layout-based, time-domain signal integrity/power integrity/electromagnetic interference simulations
LPDDR5/4X/4/3 and DDR5/4/3L/3, to 6400Mbps and beyond
Configurable, extensible, scalable
高性能、低能耗的视觉/AI 和图像处理
Electronics cooling simulation software for accurate and fast analysis of the thermal performance of electronics systems.
快速准确的叶轮机械CFD工具
High-performance, configurable, and extensible controllers and DSPs
Industry’s first complete analog IC design-for-reliability solution
Advanced mixed-signal simulation solution
Comprehensive analyses for robust design and verification of analog, RFIC, memory, and mixed-signal designs
Next-generation FastSPICE simulator delivering up to 3X productivity gains and high accuracy for memory and SoC designs
Accurate and fast simulation for RFIC circuits
FastSPICE high-performance and capacity simulation needed to handle memory and mixed-signal designs
面向混合信号设计的时序驱动数字模块实现方法
In-design manufacturing signoff at advanced nodes
Design rule checking and layout vs. schematic verification
Delivering overnight concurrent full-chip optimization and signoff
ECO automation for greater predictability and design convergence
Formal verification technology for fast and accurate bug detection and correction
Fast and accurate power intent verification and design checks
Massively parallel RTL synthesis and physical synthesis
Automated validation and refinement of timing constraints
Smart instance selection, adaptive proof technology, and massively parallel architecture improve turnaround time and performance
A flexible, signoff-driven environment for fast implementation of giga-scale designs
SoC verification with portable stimulus
3D FEM EM design verification inside Microwave Office software
Rapid system-level verification deployment
System emulation under real-world operating conditions
Full system-verification solution
Verification automation from block to chip to system levels
A powerful, scalable, and automated verification planning and management solution supporting multi-user, multi-engine, multi-projects, and multi-sites simultaneously
For Cadence Virtuoso Users
VCAD Productivity Package for Virtuoso
For Cadence Virtuoso, Encounter, and Incisive Users
Visual programming tool for Virtuoso PCell developers
DC and thermal analysis for packages and boards