Millennium Platform
AI-driven digital twin supercomputer
Cerebrus Intelligent Chip Explorer
AI-enabled design optimization
Optimality Intelligent System Explorer
AI-driven Multiphysics analysis
Verisium Verification Platform
AI-driven verification platform
Allegro X AI
AI-driven PCB Design
Tensilica AI Platform
On-device AI IP
Virtuoso Studio
Analog and custom IC design
Spectre Simulation
Analog and mixed-signal SoC verification
Innovus Implementation System
Physical design for advanced nodes
Xcelium Logic Simulation
IP and SoC design verification
Silicon Solutions
Protocol IP and Compute IP, including Tensilica IP
Palladium and Protium
Emulation and prototyping platforms
Allegro X Design Platform
System and PCB design platform
Allegro X Adv Package Designer Platform
IC packaging design and analysis platform
Sigrity X Platform
Signal and power integrity analysis platform
AWR Design Environment Platform
RF and microwave development platform
Cadence Reality Digital Twin Platform
Data center design and management platform
Fidelity CFD Platform
Computational fluid dynamics platform
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Circuit, system, and EM/thermal simulation for RF to mmWave product development
Intelligent debugging, optimization, and signoff closure
Physics-based simulation software for data center design using digital twin models. The software leverages CFD simulation to facilitate design from conceptual prototyping through to detailed design of the data center
Data center management solution for capacity planning and resource management to maximize operational performance
Physics-based simulation software for the next generation of data center design and management to maximize operational performance
In-design signal and power integrity analysis for IC packages
In-design signal and power integrity analysis for PCBs
The gold standard in chip-level electromagnetic modeling
The fastest synthesis with utmost PCell flexibility
Thermal analysis inside Microwave Office software
A complete electrical-thermal co-simulation technology for IC packages, PCBs, and systems
Electronics cooling simulation software for accurate and fast analysis of the thermal performance of electronics systems.
Turbomachinery CFD for fast and accurate simulation of rotating machinery
High-performance, configurable, and extensible controllers and DSPs
Industry’s first complete library characterization system optimized for the cloud
Improve the accuracy and quality of your component libraries
Fast, intuitive design entry with reuse of preferred, current parts
Create design intent with ease for simple to complex designs
A collaborative environment to improve design team productivity, across the entire lifecycle from requirements to manufacturing.
FPGA-PCB co-design with automatic rules-driven pin assignment
Maximizing productivity in a powerful library development environment
Managing complexity for faster, more cost-effective implementations
Design collaboration, traceability, and visibility
System architecture design and implementation for multi-board PCB systems
Integrating RF circuits onto mixed-signal PCB design
Frequency-domain power- and signal-integrity analysis
Product portfolio
3D planar EM analysis software
Full 3D finite element method EM analysis software
Communications and radar systems design software
Simulation and design flow technologies that support MMIC product development
Simulation and design flow technologies for high-frequency PCB development
System-level design planning and optimization from silicon through IC packaging to PCB
LPDDR5/4X/4/3 and DDR5/4/3L/3, to 6400Mbps and beyond
Specially designed for floating-point processing with exceptional PPA
Fastest path from specification to silicon
Distributed STA with integrated layout fixing
Cost-based power-delivery network design
Accurately assess high-speed, chip-to-chip system designs
Layout-based, time-domain signal integrity/power integrity/electromagnetic interference simulations
Full-wave and quasi-static solver technology for IC package and PCB capable of accurate analysis of complex 3D structures
IC package model extraction
High-performance, low-energy vision/AI and image processing
Configurable, extensible, scalable
Timing-driven digital block implementation for a mixed-signal design methodology
In-design manufacturing signoff at advanced nodes
Comprehensive analyses for robust design and verification of analog, RFIC, memory, and mixed-signal designs
Automated validation and refinement of timing constraints
A flexible, signoff-driven environment for fast implementation of giga-scale designs
Massively parallel RTL synthesis and physical synthesis
Fast and accurate power intent verification and design checks
System-driven PPA closure for 3D-IC designs
Meet PPA and TAT targets at advanced nodes
In-design and back-end physical verification for faster final signoff
Cloud-ready, massively parallel physical signoff
Easy-to-use, high-performance, and standalone chip-finishing system
Industry’s first complete analog IC design-for-reliability solution
Accurate and fast simulation for RFIC circuits
FastSPICE high-performance and capacity simulation needed to handle memory and mixed-signal designs
Advanced mixed-signal simulation solution
Next-generation FastSPICE simulator delivering up to 3X productivity gains and high accuracy for memory and SoC designs
Design rule checking and layout vs. schematic verification
ECO automation for greater predictability and design convergence
Smart instance selection, adaptive proof technology, and massively parallel architecture improve turnaround time and performance
Delivering overnight concurrent full-chip optimization and signoff
Formal verification technology for fast and accurate bug detection and correction
Unified power calculator for accurate RTL power and signoff-quality gate power
Reduce test time by up to 3X without impact to fault coverage or chip size
Next-generation tool with the fastest performance and scalability, best-in-class accuracy using smart solvers, and in-design and signoff parasitic extraction that customers trust
True 3D electromagnetic field solving for PCB and IC package designs
3D FEM EM design verification inside Microwave Office software
Full system-verification solution
SoC verification with portable stimulus
System emulation under real-world operating conditions
Rapid system-level verification deployment
Verification automation from block to chip to system levels
A powerful, scalable, and automated verification planning and management solution supporting multi-user, multi-engine, multi-projects, and multi-sites simultaneously
For Cadence Virtuoso Users
Visual programming tool for Virtuoso PCell developers
For Cadence Virtuoso, Encounter, and Incisive Users
Efficiently design complex packages with first-pass success
Enhanced capabilities for multi-chip packaging technologies
VCAD Productivity Package for Virtuoso
DC and thermal analysis for packages and boards