Rockley Photonics、ハイパースケールデータセンター向け高性能システム開発に関してケイデンスと協業
SAN JOSE, Calif., 02 Dec 2020
要旨:
- ケイデンスのシステム解析およびカスタムIC設計に関する包括的なソリューションにより、Rockley Photonicsは後戻りのない設計を実現
- 先端電磁解析フローにより、従来と比較して12倍の性能向上を実現
Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that Rockley Photonics, a leading supplier of integrated photonic solutions, has deployed a comprehensive set of Cadence® system analysis and custom tools to design a state-of-the-art, high-performance System-in-Package (SiP) for hyperscale data centers.Using a broad suite of Cadence tools, Rockley Photonics achieved first-pass success, accelerating time to market.
The Rockley Photonics device is a complex system-in-package solution, comprised of discrete chiplets connected through a high-speed 112G PAM4 serial interface.To successfully complete the project, the Rockley Photonics design team needed a powerful, comprehensive combination of Cadence system analysis and custom tools, featuring the Clarity™ 3D Solver, Allegro® technologies and the EMX® 3D Planar Solver; custom technologies including the Virtuoso® RF Solution and Spectre® X Simulator; and the Quantus™ Extraction System for signoff.The Cadence design tools—across chip, package, board and system—offer a tight integration that doesn’t exist with other solutions on the market, providing Rockley with a complete solution for system innovation.
The Rockley engineering team utilized the Clarity 3D Solver to analyze system-level electromagnetics effects, a task they couldn’t achieve with other tools.Using the Clarity 3D Solver from within the Virtuoso RF Solution, Rockley Photonics’ engineers successfully modeled coupling between the chiplets, the board, and the high-speed transmission lines—including wirebonds—all the way to the photonics chiplet, ensuring complete system performance.In addition, the Cadence EMX® 3D Planar Solver provided a truly differentiated electromagnetic flow that enabled Rockley Photonics to demonstrate a 12X performance improvement over legacy design flows.
“At Rockley Photonics, we routinely evaluate our system design methodology so we can find ways to improve and enable our engineering team to perform at their peaks,” said David Nelson, vice president, IC design at Rockley Photonics.“By using the integrated Cadence flow, we were able to capture a deterioration in the 50-60GHz frequency range through its cross-fabric coupling capabilities, whereas our previous flow, which utilized a single-fabric approach, was not able to capture the deterioration.In addition, the Clarity 3D Solver demonstrated impressive scaling up to 128 CPUs, and the entire 100GHz cross-fabric design was extracted in just three hours.”
The Cadence system analysis and custom tools support the company’s broader Intelligent System Design™ strategy, providing customers with an efficient path to achieve system innovation.For more information, visit www.cadence.com/go/systemrpr.
ケイデンスについて
ケイデンスは30年以上にわたり蓄積した演算ソフトウェア(computational software)の専門知識を基盤とする電子設計業界のリーダーです。Intelligent System Design戦略のもと、設計コンセプトを実現するためのソフトウェア、ハードウェア、IPを提供しています。ケイデンスのお客様は、世界で最も革新的な企業であり、コンシューマー、ハイパースケールコンピューティング、5G通信、自動車、モバイル、航空宇宙、産業、ヘルスケアなど、最もダイナミックな市場アプリケーションに向けて、チップからボード、システムに至るまで、卓越した電子製品を提供しています。フォーチュン誌は6年連続で、ケイデンス社を「働きがいのある会社ベスト100」に選出しています。ケイデンスに関する詳細についてはcadence.comをご参照ください。
この件に関するお問合せ:
Cadence Newsroom
408-944-7039
[email protected]
お問合せ先